Development of a Variety of Alloys
DAIKI's powerful research and development with a large number of
achievements in the past have been widely known in the industry.
The following ones are some of the results of the research and development.
(2) HT-1 Highly Thermal Conductive Alloy
for Die-casting Applications (Patent Pending)
The HT-1 alloy provides high thermal conduction that
cannot be achieved by conventional aluminum alloys.
|Ensures the highest fluidity with a 12% to
14% Si content in comparison with other alloys for die-casting
purposes, thus the thin portion is perfectly filled.
|The alloy with a 0.5% to 1.0% Fe content is prevented from
sticking to the die.
|Ensures castability, thus ensuring a good product yield.
|Parts that require good heat dissipation characteristics,
e.g., computers, game machines, heat sinks for electric devices,
and heating blocks.